ESSENTIAL PCB BOARD DESIGN WITH IPC STANDARDS

This program summarises the essential knowledge required for engineers to successfully build PCB circuit boards.

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ESSENTIAL PCB BOARD DESIGN

WITH IPC STANDARDS

This workshop training provides an overview of the principles related to PCB design in various industries and is strongly recommended for individuals interested in obtaining the IPC CID and CID+ certification. This program summarises the essential knowledge required for engineers to successfully build PCB circuit boards. Discussions on military standards as compared to IPC standards will also be included.
Reference to standards examples included in the training course:

- IPC 2221 (Generic Standards on PCB)
- IPC 2222 (Sectional Design for Rigid PCB)
- IPC 600 (Acceptability of Printed Boards)
- IPC 610 (Acceptability of Electronic Assemblies)
- IPC 2251 (High Speed Packaging)
- IPC 2252 (RF and Microwave)

Examples will be provided to meet Class 2 and Class 3 electronics.
Case study discussions include:
(a) Extreme Environment Product Requirements
(b) High Density Product Requirements. Examples include Test board design for IC testing, basic HDI terminologies and structures & BGA considerations.

Course Actions

Introductory Video

Course Overview

This workshop training provides an overview of the principles related to PCB design in various industries and is strongly recommended for individuals interested in obtaining the IPC CID and CID+ certification. This program summarises the essential knowledge required for engineers to successfully build PCB circuit boards. Discussions on military standards as compared to IPC standards will also be included. Reference to examples will meet Class 2 and Class 3 electronics requirements.

Course Outcomes

Detailed training syllabus and modules include:

Introduction to IPC Standards for PCB Design

General Overview
Performance Classes (1, 2, and 3)
Manufacturer Levels (A, B, and C)
Comparing Class 2 and Class 3

Design for Manufacture (DFM)

Video Training Session
Analysis of Board View
Selection of Board Materials
Solder Suspend Parameters
Surface Finish Options
Logomask Application
Conformal Coating Processes

Design for Thermal Management

Managing Thermal Components
Board-Level Thermal Management
Introduction to Mechanical Shock and Vibration

Design for Electrical Functionality
- Foundational Electrical Theory
- Logic Flow vs. Schematic Representation
- Impedance Control Techniques
- Crosstalk and Noise Reduction Strategies
- Return Path Grounding Concepts
- EMI Principles and Shielding Methods

Design for Assembly (DFA)

SMT Process Overview (Video)
Evaluation of Component Selection
Land Pattern and Footprint Requirements
Essential Assembly Documentation

Design for Test (DFT)

Bar Testing Protocols
ACT Board Testing
Functional Test Methods
Burn-In Stress Testing
HALT and HASS Reliability Tests
GDS Updates for High-Density Product Testing

Design for Reliability (DFR)

Discipline Overview
Maintaining Consistent Design Concepts
Implementing Redesigned Solutions
Managing Moisture Sensitivity Levels (MSL)
Assembly Methods and Surface Finishes

Common Design Errors

Manufacturer and Assembler Feedback
Case Studies: Extreme Environments and High-Density Products

Documentation Standards

Documentation Overview
IPC Guidelines for Documentation
Master Drawing Examples
Gerber EOT Dimensioning and Tolerancing

Course Summary

Final Quiz (20 Multiple Choice Questions)
Self-Evaluation Exercise
Distribution of Certificates of Attendance

Course Details

Length

3 Days

Short-term Course

Type

IPC standards-focused training

Focus

Target Audience

Fresh graduates / New designers
Hardware engineers
CAD layout designers
PCB designers / DFM PCB designers
Managers and personnel involved with electronic board design projects
Personnel interested in IPC design standards, Class 2 and Class 3 electronics design

Learning Outcomes

Upon completing the course, participants will:

Acquire knowledge to implement IPC standards in PCB Design
Acquire knowledge of DFM, DFA, DFT
Acquire ethics and awareness of safety and responsibility in electronic design and products
Acquire awareness for Class 2 and Class 3 design specifications
Acquire essential knowledge for IPC PCB Designers Certification

Course Facilitator

Cheah Soo Lan spent the last 20 years as an engineering manager for the technical and vocational education in the electronics and semiconductor industry in the Asia Pacific region.

She is a user of both PCB CAD and Custom IC Design layout tools. She is also a certified Master IPC Trainer (MIT) for PCB Design CID and CID+ under IPC International (SE Asia, China and India) and a certified trainer since 2007.

She conducted numerous governments funded long term projects and public short-term training for industry. She is currently heading the strategic analysis for electronics and semiconductor industry at a local training centre.

Prior to education and teaching, she was a full-time engineering staff in Singapore for 15 years in supporting the network & telecommunication industry, research and development department for computing, electronics and semiconductor at the national research centres and defence industry of Singapore. Several research papers were published during this time.

In recent years, included data science concepts, machine learning and CFX Connected Factory Exchange concepts as with the increasing digitalization of equipment and AI applications.

Ms Cheah graduated with a BEng (Hons) University of Essex UK, MSc (Microelectronics) National University of Singapore, CVET Certified Vocational Education and Training Level 3 (Box Hill, Australia).

Cheah Soo Lan