GAIN INTERNATIONAL RECOGNITION IN IPC STANDARDS
IPC ADVANCED CERTIFIED INTERCONNECT DESIGNERS (CID)
ADVANCE YOUR PCB DESIGN CAREER WITH IPC CID CERTIFICATION
In today's fast-paced business climate, where work projects grow in complexity and responsibilities are constantly expanding, certification is a clear testimony to your qualifications, knowledge, and skills. As a printed circuit board designer, you deserve the benefits and recognition that the IPC Designer and Advanced Designer certifications bring, to take advantage of career opportunities in outsourcing and concurrent engineering. These certifications are powerful tools you can use to promote your capabilities.
Course Introduction
In today's fast-paced business climate, where work projects grow in complexity and responsibilities are constantly expanding, certification is a clear testimony to your qualifications, knowledge, and skills. As a printed circuit board designer, you deserve the benefits and recognition that the IPC Designer and Advanced Designer certifications bring, to take advantage of career opportunities in outsourcing and concurrent engineering.
Course Structure
This certification course is structured into the following chapters:
Professional Certification Tracks
Chapter 1 – Design Considerations
1.1 Considerations for Design
1.2 Placement & Routing Techniques
1.3 Functional Electrical Characteristics;
1.4 Copper Clad Laminates
1.5 Holes in Printed Boards
1.6 Drilling & Hole Locations
1.7 Features Formed in Copper
Chapter 2 – Thermal, Reliability & Testing Issues
2.1 Thermal Management for Boards
2.2 Thermal Management for Assemblies
2.3 Reliability - Terms & Design Issues
2.4 Testing
Chapter 3 – Physical Board Principles
3.1 Printed Board & Assembly Viewing Principles
3.2 Datum Dimensioning
3.3 Grid Systems
3.4 Tooling Holes & Fiducials
3.5 Board & Assembly Panelization
3.6 Panel Separation Methods
Chapter 4 – Component Types
4.1 Component Overview
4.2 Edge Board Connectors
4.3 Stiffeners
4.4 Bus Bars
4.5 Sockets
4.6 Jumpers & Terminals
4.7 MELF
4.8 Eyelets
Chapter 5 – Component & Assembly Issues
5.1 Designing for Assembly
5.2 Mounting Through-Hole Component
5.3 Mounting Surface Mount Components
5.4 Component Modifications
5.5 Component Insertion & Attachment Technique
5.6 Solder Processes
5.7 Clinched & Un-clinched Leads
Chapter 6 – Board Surface Treatments
6.1 Solder Mask
6.2 Conformal Coating
6.3 Protective Coatings/Surface Finishes
6.4 Legend
Chapter 7 – Documentation & Dimensioning
7.1 Documentation & Classifications
7.2 Basic Drawing Formats
Chapter 8 – Schematic & Logic Diagrams
Chapter 9 – Fabrication & Tolerating Requirements
9.1 Board Fabrication Documentation
9.2 Dimensioning & Tolerancing
Chapter 10 – Assembly Documentation & BOMs
Certification Examination: Exam Day – 2 Hours Certification Test.
Complete the following curriculum leading to the professional examination:
Course Length
5 Days
Duration
Includes certification assessment
Assessment
Intensive certification program
Program
Target Audience
- Hardware Engineers
- Electronic Product Designers
- CAD Layout Designer
- PCB Designer & DFM PCB Engineers
- R&D Engineer in Electronics-related Industry
- Managers and Personnel Involved with Electronics Board Design, PCB Design and Layout
Course Materials
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IPC-2221, Standard on Printed Board Design
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IPC-2222, Sectional Standard on Rigid Organic Printed Boards
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DRM-18H, Component Identification Training and Reference Guide
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CID Study Guide, Provides the framework for application of IPC standards in design decision making
Course Facilitator
Cheah Soo Lan spent the last 20 years as an engineering manager for the technical and vocational education in the electronics and semiconductor industry in the Asia Pacific region. She is a user of both PCB CAD and Custom IC Design layout tools. She is also a certified Master IPC Trainer (MIT) for PCB Design CID and CID+ under IPC International (SE Asia, China and India) and a certified trainer since 2007. She conducted numerous governments funded long term projects and public short-term training for industry.
She is currently heading the strategic analysis for electronics and semiconductor industry at a local training centre. Prior to education and teaching, she was a full-time engineering staff in Singapore for 15 years in supporting the network & telecommunication industry, research and development department for computing, electronics and semiconductor at the national research centres and defence industry of Singapore. Ms Cheah graduated with a BEng (Hons) University of Essex UK, MSc (Microelectronics) National University of Singapore, CVET Certified Vocational Education and Training Level 3 (Box Hill, Australia).
Cheah Soo Lan
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