GAIN INTERNATIONAL RECOGNITION IN IPC STANDARDS
IPC ADVANCED CERTIFIED INTERCONNECT DESIGNERS (CID+)
MASTER HIGH-DENSITY, HIGH-SPEED PCB DESIGN WITH IPC CID+
As the PCB design industry moves towards high-density and complex boards, designers are facing issues in areas such as crosstalk, high-speed or EMI. But with little or no knowledge of industry standards and common practices in signal integrity, resolving these problems can be a challenge. This advanced-level syllabus covers the essential fundamentals in Impedance Design, Signal Integrity (SI), Layout for Crosstalk Minimisation, Power and Ground Routing Techniques, Electromagnetic Interference (EMI) and Shielding to provide you with skills that are crucial in the current era of electronic system designs. You will learn the concepts behind SI and EMI, where they come from, and how to control them on a PCB board design to boost system performance. Join us in the advanced CID+ to further expand your technical and design knowledge. This special CID+ class will include a review of IPC 2251 and IPC 2252.
Course Introduction
As the PCB design industry moves towards high-density and complex boards, designers face issues like crosstalk and EMI. Without knowledge of signal integrity standards, these problems are hard to solve. This advanced syllabus covers Impedance Design, SI, EMI, and Shielding, providing crucial technical skills for modern electronic system designs to boost performance.
Course Structure
This advanced CID+ course covers the following key areas:
Professional Certification Tracks
Design Considerations
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Board Material Properties
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Plating Characteristics for Conductors and Holes
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Surface Finish and Treatment Characteristics
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Solder Mask/Coating, Material Properties and Compatibility
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Homogenous Material Performance Capability
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Assembly Test Implementation
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Test Points / Land Pattern Feature Differentiation
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In-Process Test Coupons
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Highly Accelerated Stress Test Evaluation
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Management Tools and Techniques for Product Quality Life-Cycle Tracking
Electrical Parameters
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Electrical Clearance and Dielectric Spacing
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Power and Ground Routing Techniques
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Conductor Current Carrying Capacity vs. Temperature Rise
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Layout Approaches for Crosstalk Minimization
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Shielding Techniques to Prevent Signal Emission
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Test Evaluations for EMI Emissions/Susceptibility
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General Principles of Impedance Control
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Signal Integrity Analysis
Component & Assembly Issues
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Component Comparison Between Area and Peripheral Arrays
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Component Mounting Strategies
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Component Assembly Strategy and Sequence Analysis
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Component Mounting Shock and Vibration Requirements
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Evaluation of Component Attachment Methods
Printed Board Characteristics
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Design Standards to Meet Fabrication and Assembly Goals
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Fabrication Equipment Board Size Limitations
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Printed Board Length to Width Relationships
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Broad from Panel Excising Requirements
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Copper Balance Effects on Printed Board Fabrication
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Printed Board Thermal Management Techniques
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Controlled Expansion Construction using Special Cores
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Physical Board Dielectric Parameters
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Non-Standard Mechanical Outline (Case) Integration
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Individual Board Tooling Considerations
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Panelization Strategy for Manufacturing Process
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Blind and Buried Vias
Exam Day
Dimensioning & Documentation
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Material List Development
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Printed Board Tolerance Analysis (Manual vs. Automated)
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Documentation to Facilitate Design to Fabrication Interface
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Printed Board and Assembly Data Format Standardization
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Assembly Repair and Modification Tools and Techniques
Certification Assessment
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Quiz Session
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Certification Test (2.5 hours)
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120 test questions
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Marking of Exam Paper
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Review Exam Questions
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Other Q & A
Course Length
5 Days
5 Days
Including certification examination
Assessment
Advanced certification program
Program
Target Audience
- Hardware Engineers
- Electronic Product Designers
- CAD Layout Designer
- PCB Designer & DFM PCB Engineers
- R&D Engineer in Electronics-related IndustryManagers and Personnel Involved with Electronics Board Design, PCB Design and Layout
Prerequisite
- IPC CID (Certified Interconnect Designer) certified. Participants are expected to have completed the IPC CID certification before attending the advanced CID+ course.
Course Facilitator
Cheah Soo Lan spent the last 20 years as an engineering manager for the technical and vocational education in the electronics and semiconductor industry in the Asia Pacific region. She is a user of both PCB CAD and Custom IC Design layout tools. She is also a certified Master IPC Trainer (MIT) for PCB Design CID and CID+ under IPC International (SE Asia, China and India) and a certified trainer since 2007. She conducted numerous governments funded long term projects and public short-term training for industry.
She is currently heading the strategic analysis for electronics and semiconductor industry at a local training centre. Prior to education and teaching, she was a full-time engineering staff in Singapore for 15 years in supporting the network & telecommunication industry, research and development department for computing, electronics & semiconductor at the national research centres and defence industry of Singapore. Several research papers were published during this time. In recent years, included data science concepts, machine learning and CFX Connected Factory Exchange concepts as with the increasing digitalization of equipment and AI applications. Ms Cheah graduated with a BEng (Hons) University of Essex UK, MSc (Microelectronics) National University of Singapore, CVET Certified Vocational Education and Training Level 3 (Box Hill, Australia).
Cheah Soo Lan
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