PCB Layout and Circuit Analysis Techniques

Create Intelligent PCB layouts maximised for RF and high-speed performance

PCB Layout and Circuit Analysis Techniques to maximize RF/high-speed performance course

An intelligently designed RF PCB requires careful groundwork, an initial well-planned schematic and close coordination between all designers. Planning for high-speed applications makes the process even more challenging, as you need to know the specifications and position of every single component, including exactly how they interconnect with each other. If you are tempted to cut corners and disregard industry best practices, you can expect costly design changes late in the process.

With the three-day PCB Layout and Circuit Analysis Techniques to Maximize RF/High-Speed Performance course, practicing RF engineers and CAD technicians can develop a series of simple design rules to follow each time they design a new circuit. Learn about common RF and digital PCB design issues, transmission line types, termination types, packaging types and more, and use an optimal design tool to maximize RF and high-speed performance on time and within budget. It is perfect for anyone working with RF circuits or high-speed digital logic!

Learning Outcome

Upon completing the course you will be able to:

Fundamental RF and digital PCB design issues
How to compare transmission line types, characteristics, and situations in which they can be used
How to describe, evaluate, and compare termination types, PCB materials and fabrication processes, and packaging types
How to identify and compensate for sources of interference such as EMI and EMC
How to measure and fine-tune circuit performance
How to identify and select tools for analyzing RF and high-speed PCB layouts
How to develop RF/high-speed layout rules

Target Audience

RF engineers
Digital logic engineers
Technicians
PCB layout professionals

Course Content

Day 1 — Fundamentals of RF and High-Speed Data

Understanding the difference between RF and speed

RF, mixed signal and high-speed layout differences and RF performance
Defining frequency, wavelength, skin effect, near-field/far-field impedance and signal integrity
Mismatch loss; RF and digital matching techniques
Developing PCB design rules for RF, mixed signal, high-speed data and power supplies

Matching techniques: power vs. signal integrity

Matching for power or voltage, with discrete components or transmission lines
Minimising reflections
Large signal vs. small signal matching techniques
Narrow and broadband networks
Defining and scattering RF parameters
Optimising matching networks using the PC board
Square waves in the frequency domain
Propagation delay, reflections and ringing
RF and digital matching examples using simulation software tools

Day 2 — Transmission Line Fundamentals

The connecting link between two RF sources

PCB traces
Velocity of propagation
Electrical length, skin effect, microstrip and striplines
Line impedance, bends and corner compensation, reflected waves and terminations
Layer changes for transmission lines
Design trade-offs – impedance, losses, phase matching and spacing
Transmission line design examples using RF simulation software tools

The PCB multi-layer interconnect

Plated vs. filled holes for optimum RF performance
Types of via’s, modelling the via hole stray inductance and RF resistance
Wavelength analysis via board material
Minimising RG current path lengths for RF currents
Picket fence designs to minimise crosstalk and reduce radiation
Thermal considerations
Filled vs. plated via’s as a function of substrate thickness
RF simulation models and test data showing performance comparisons

Day 3 — PCB Design Structures and Material Types

The starting point for understanding PCB challenges

PCB structures and material types
Dielectric constant and the thermal factor
Stacking solutions (layer count)
Transmission line traces, impedance tolerances, via’s and routing
Power and ground distribution
Decoupling techniques such as surface mount components and PCB capacitance
Interfacing with mixed signal and high-speed data (RF to A/D)
Large signal routing for clocks and oscillators
PCB parasitics
Minimising split planes

Shielding/Minimising EMI/EMC/RFI

Defining shielding requirements, including near-field and far-field properties
Electric and magnetic field impedances
Absorption and reflection
Defining how a shield works
Shield material typesRadiation through vent holes and slots
Gaskets to minimise radiation due to contact discontinuities
High vs. low frequency shielding techniques

Recommended Prerequisites
Please note a practical engineering background and basic mathematics are required to follow the course.

Course Details

3 Days

09:00 - 17:00

Course Facilitator

Mr. Richard (Rick) Fornes has over 33 years’ experience in consumer radio products as well as advanced military communication systems. Throughout his career, he has served as a Program Manager, Engineering Manager, and Consultant for high-profile companies such as Nokia, Lucent, Trimble Navigation, Plantronics, Texas Instruments, and General Dynamics. He is currently employed in the RF semiconductor industry.

Initially, Rick’s interests were focused on the design of complete RF systems architectures for commercial radio and cellular-based systems. Since 2008, he has been involved in the design and development of Global Positioning Systems (GPS) M-Code radio architectures as well as RF synthesizers for the US Navy AMDR (Air and Missile Defense Radar) programme.

Over the past 20 years, Rick has developed several RF technical courses on microwave circuits and system design techniques, and has taught over 4,000 short courses worldwide through Besser Associates, a leading RF training organization worldwide. He has also authored numerous conference papers on RF-related topics such as the design of power amplifiers and low-cost wireless systems.

Rick is a member of Besser Associates Technical Advisory Board, IEEE and ARR.

He received his B.S.E.E. Degree in 1982 from California Polytechnic State University in San Luis Obispo, California, and has completed advanced studies in microwave engineering system architectures and power control.

Dr. Richard Fornes

PCB Layout and Circuit Analysis Techniques