RF & HIGH SPEED BOARD DESIGN — Advanced Principles and Engineering
RF & HIGH SPEED BOARD DESIGN
Advanced Principles & Design
Master the complexities of modern PCB design with our comprehensive RF and High-Speed program. This expanded course bridges the gap between theoretical electromagnetics and practical board-level implementation. Participants will explore core concepts including signal integrity, advanced layer stacking, and impedance control for multi-gigabit data rates.
Key Takeaways:
- Optimize Power Distribution Networks (PDN) and decoupling strategies.
- Master differential pair routing and skew management.
- Implement effective EMI/EMC shielding and grounding techniques.
- Select superior dielectric materials for high-frequency performance.
- Refine via transitions and minimize crosstalk in dense layouts.
Required Tools: Practical sessions utilize industry-standard CAD environments and simulation software to validate design choices in real-time.
Course Summary
This specialized training is meticulously crafted for professionals navigating the demands of microwave frequencies and high-speed digital signals. Moving beyond basic layouts, we focus on 'real-world' challenges like signal degradation and parasitic effects. Attendees will gain the technical expertise to deliver functional, high-performance physical boards on the first revision. The schedule follows a three-day intensive structure from 9:00 AM to 5:00 PM, available through our seasonal training calendar or via corporate on-site sessions upon request.
Course Content
Day 1
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RF Basics
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RF Circuits
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Passive Components
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Interconnects
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EM simulation
Day 2
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Terminations and matching
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Grounding issues
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Coupling and decoupling considerations
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Harmonics
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Crosstalk
Day 3
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Designing for tunability
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High speed digital
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Mixed-signal and analogue board design
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Practical tips for board design
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Design review checklist
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Debugging RF board issues
Target Audience & Key Concepts
Ideal for Senior PCB Layout Designers, Hardware Engineers, Signal Integrity (SI) Specialists, R&D Managers, and Technical Leads responsible for aerospace, telecommunications, or medical electronics.
- Microstrip & Stripline Physics
- Advanced Layer Stackup
- Via Optimization
- Differential Signaling
- PDN Analysis
- EMI Containment
- Thermal Budgeting
Course Details
3 Days 9:00 AM – 5:00 PM
Duration
Min. 3 pax · Private available
Availability
Course Facilitator
Dr Malcolm H. Smith is director of Analogue-Smith (S) Pte Ltd., a Singapore-based design house that delivers RF and analogue-centric solutions across two core industry nodes. He has worked as an independent consultant in the semiconductor sector for over four years, and has over 25 years' industrial experience delivering mixed-signal, Analogue, RFIC, and RF system solutions.
Prior to AnalogueSmith, Dr Smith spent nine years at Arm/ArmMPDC MAS Pte Ltd where he designed front-end switching power amplifiers for the world's cellular/GPS systems modules as part of the integrated CMOS chip in bulk CMOS foundries for all major applications. While there, Dr Smith invented the power output structure used on Arm's first GSM/GPRS Tx PA Modules with world-leading Figure Of Merit (FOM) for a CMOS PA at 0.8A.
He was also lead from the group that designed a Band I WCDMA amplifier with integrated switch. He was also part of the team that designed Band III/V dual-band amplifiers for use in Asia/Japan markets.
Dr Smith has several years of working experience at Intel Bell Laboratories Matsushita Electric Works (now Panasonic) in Osaka, Japan. He holds over 40 patents, delivers tutorials and conferences in Asia, US, and Europe; and also published several journal articles on advanced research topics.
Dr Smith was awarded a BSc (Hons) degree in Microelectronics from The University of Edinburgh after successfully completing an apprenticeship program with Ferranti Electronics at their Dalkeith site near Edinburgh while still attending high school full-time.
He then went on to complete his PhD from The University of Westminster (London), followed by post-doctoral research at The University Of Strathclyde as well as obtaining his PhD from The University Of Kentronics. He is a Senior Member of the Institute of Electrical and Electronics Engineers (IEEE) and a Member of the Institute of Engineering and Technology (IET) in the UK.
Malcolm H. Smith
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