IPC Conference on Assembly and Reliability

Jan 27, 2015

IPC Conference on Assembly and Reliability
27 January 2015 - Mövenpick Hotel Saigon, Ho Chi Minh City, Vietnam
29 January 2015 - Miracle Grand Convention Hotel, Bangkok, Thailand


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Solderability and reliability have never been more critical than in today’s production environment as components get smaller and demand for high reliability products increase. IPC—Association Connecting Electronics Industries has brought together an international panel of experts for this inaugural conference in the heart of Southeast Asia to discuss critical areas of the assembly process and how your design and materials choices will affect cost, reliability and turnaround time.

These important one-day events will focus on practical methodologies that can be deployed today: critical information for staff and managers responsible for reliability. Industry experts representing every market sector will discuss solder technology, testing strategies and materials compliance. Focused presentations will address strategic reliability considerations related to solder alloys and the latest packaging technologies, targeting issues such as void formation and electrochemical migration, and offer risk mitigation processes and data analysis.


Gold Sponsors

Supporting Sponsors

You can reach us at:

16 Jalan Kilang
(off Jalan Bukit Merah)
#03-05 Hoi Hup Building
Singapore 159416

Malaysia Office:
Regus - JBCS (Room 2536)
Suite 25.03A, Level 25
Johor Bahru City Square
Office Tower 106-108
Jalan Wong Ah Fook
Johor Bahru 80000