PCB Fabrication Specifications:

• Rigid, Flex, Rigid-Flex
• Prototype, NPI, HMLV build
• Up to 50 Layers
• Board size 24” x 31” max
• Board thickness 0.25 ~ 3.20mm
• Copper Thickness up ⅓ ~ 6oz
• Aspect Ratio 30:1
• Type of PCB - FR4, High-Tg FR4, Halogen-Free, High Temp PCB, Aluminium PCB, PI, Telfon, Hybrid
• Laminates - Roger, Nelco, Arlon, Isola, Sheng Yi, Doosan, ITEQ, Taconic, TUC, Megatron, ThinFlex, Dupont
• Min. trace width/gap 3/3mils
• Min. via (mech) 6mils, min. via (laser) 4mils
• Via plugging/filling (non-conductive, conductive)
• Via in pad (plated shut), Blind/Buried Via
• Back-drill depth tolerance 8mil (min)
• Edge plating (half-hole)
• HDI up to 4+4+4, ALIVH (Any-Layer)
• Impedance control up to ± 5%
• HASL, LF-HASL, ENIG, Immersion Silver/Tin, ENEPIG, OSP/Entek, Hard/Flash/Electrolytic Gold, Soft Bondable Gold, Carbon
• Soldermask registration 2mils (min)
• Soldermask green, red, blue, black, purple, orange, yellow
• Electrical Test (jig/flying-probe), Solderability Test (IR Reflow), Thermal Stress Test (288°C), Micro-Section Analysis, Ionic Contamination Test, Hi-Pot Test, TDR Measurement, SM/SS Peeling Test
• Country of Manufacturer – Taiwan, Korea, China, Vietnam, Singapore, USA