PCB Assembly
Wizlogix Pte Ltd provides local PCB assembly supported by IPC-CIS 610 trained technical engineers, combining skilled expertise with vision-equipped SMT technology to deliver precise and reliable assemblies.
Our capabilities support components ranging from 0201 chip sizes to large PLCCs and QFPs, as well as BGA components up to 52 × 52 mm with 0.5 mm pitch. We support prototype, NPI and high-mix low-volume production, with manufacturing capabilities across Singapore, Malaysia and Korea.
PCB Assembly Capabilities
Board & Production Support
SMT & Component Placement
Soldering Processes
■ SMT IR Reflow (Up to 9+2 Zones)
■ SMT Vapor-Phase Soldering
■ Wave Soldering
■ Manual Hand-Soldering
■ Lead (Pb)-Free Compliant
BGA & Rework
■ BGA Rework / Reballing
■ Min. BGA Pitch: 0.4 mm
■ QFP / QFN Support
Inspection & Testing
■ Automated Optical Inspection (AOI)
■ 2D X-Ray Imaging Inspection
■ Functional Circuit Testing (FCT)
Stencils & Manufacturing
■ Stencil Laser Cut / E-Form
■ Manufacturing: Singapore / Malaysia / Korea
Engineering Quality: Laser-cut stencils and IPC-aligned processes support consistent assembly quality.
Use Cases
High-speed & high-density PCB design · Mixed-signal designs · RF designs · High-power applications · HDI & micro-BGA/BGA designs · Flex & rigid-flex PCBs · Controlled-impedance designs · EMI/EMC-conscious designs
Who it's For
Electronics companies, R&D teams, product developers and engineering teams requiring professional PCB design and layout support.
■ Rigid / Flex / Rigid-Flex
■ Prototype / NPI
■ High-Mix Low-Volume (HMLV)
■ Board Size: 50 × 50 to 420 × 380 mm
■ Pick & Place: Down to 0201
■ QFP / QFN / BGA / CSP / Fine Pitch
■ Min. BGA Pitch: 0.4 mm