PCB Fabrication

Wizlogix delivers industry-leading PCB fabrication solutions, bridging the gap between complex schematic concepts and manufacturing-ready reality. Our capabilities range from high-density rigid boards to advanced flex-rigid structures, all executed with precision and reliability.

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Fabrication Capabilities

Board Construction

■ Rigid / Flex / Rigid-Flex
■ Prototype / NPI / HMLV
■ Up to 50 Layers
■ HDI up to 4+4+4
■ ALIVH (Any-Layer)

PCB Materials

FR4 · High-Tg FR4 · Halogen-Free · High-Temp PCB · Aluminium · PI · Teflon · Hybrid

Supported Laminates

Rogers · Nelco · Arlon · Isola · Sheng Yi · Doosan · ITEQ · Taconic · TUC · Megatron · ThinFlex · Dupont

Quality & Testing

Flying-Probe Test

Hi-Pot Testing

Industry Standards

Acceptability of Printed Boards

IPC-A-600

Qualification & Performance

IPC-6012

Board Dimensions

■ Max. Board Size: 24" × 31"
■ Board Thickness: 0.25–3.20 mm
■ Copper Thickness: ⅓–6 oz
■ Aspect Ratio: 30:1

Surface Finishes

■ HASL / LF-HASL
■ ENIG / ENEPIG
■ Immersion Silver / Tin
■ OSP / Entek
■ Hard / Flash / Electrolytic Gold
■ Soft Bondable Gold
■ Carbon

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TDR Measurement

Micro-Section Analysis

IPC-A-600

IPC-6012

IPC-A-610

Acceptability of Assemblies

Fine Features & Vias

■ Min. Trace / Gap: 3/3 mil
■ Min. Mechanical Via: 6 mil
■ Min. Laser Via: 4 mil
■ Via-in-Pad (Plated Shut)
■ Blind / Buried Via
■ Via Plugging / Filling
■ Back-Drill Depth Tolerance: 8 mil (Min.)
■ Edge Plating (Half-Hole)

Impedance & Soldermask

■ Impedance Control: Up to ±5%
■ Soldermask Registration: 2 mil (Min.)

Available Soldermask Colours

Green · Red · Blue · Black · Purple · Orange · Yellow

Ionic Contamination

X-Ray Analysis

IPC-J-STD-001E

Soldering Requirements

Use Cases

High-speed & high-density PCB design · Mixed-signal designs · RF designs · High-power applications · HDI & micro-BGA/BGA designs · Flex & rigid-flex PCBs · Controlled-impedance designs · EMI/EMC-conscious designs